Design to Fabrication Technical Symposium, postponed

POSTPONED to September-October!!!
The PCEA (Printed Circuit Engineering Association, PCEA.net) and EIPC are pleased to announce that they will be co-hosting a ‘Design to Fabrication’ Technical Symposium.

Copenhagen, Denmark
Stockholm, Sweden
Tallinn, Estonia

The symposium is designed for designers and other professionals involved in the electronics and fabrication industries. The single attendance fee is set at €75.

09:00-09:30 hrs Walk In & Welcome by EIPC-PCEA
09:30-10:30 hrs PCB Base materials – What designers need to know Alun Morgan, Ventec International, UK
*Resin/reinforcement types and selection
*Flame retardant purpose and types
*Influence of glass transition temperature and filllers on substrate properties
*Glass fiber styles and influence on mechanical and electrical properties
*Conductor and dielectric loss and dielectric constant
*Thermal management
10:30-10:45 hrs Q&A
10:45-11:45 hrs Differential Pair Routing for SI and EMI Control (Part 1) Rick Hartley, RHartley Enterprises,  US
*Characteristics of differential pair lines
*Impact of line-to-line spacing on signal integrity
*Line length (timing) matching: How tightly?
*Impact of crosstalk on diff air behavior
*Issues that cause timing skew, including Fiber Weave
*Best diff pair line termination schemes
*A5 Impact of changing layers with differential pairs
11:45-12:30 Networking Lunch Hotel Restaurant & Table Top Networking
12:30-13:30 Differential Pair Routing for SI and EMI Control (Part 2) Rick Hartley, RHartley Enterprises,  US
13:30-13:45 Q&A
13:45-14:45 HDI and Ultra HDI PCB Manufacturing and Design Considerations Tarja Rapala-Virtanen, EIPC, FI
*Definitions of HDI and Ultra HDI PCBs
*Key manufacturing processes and associated challenges in HDI and ultra-fine line PCB technologies
*Capability and reliability aspects impacting design and end-product performance
*Design guidance to ensure manufacturability, cost-efficiency, and functionality
*Relevant industry standards guiding HDI and fine-line PCB development
*Sustainability and environmental aspects in advanced PCB manufacturing
14:45-15:00 Q&A
15:00-15:30 Coffee break & Table Top Networking
15:30-16:30 Design with the end in Mind Steve Driver – Jack Herring, Jiva Materials, UK
*Laminate choice
*Copper weights
*Additive technology
*Inkjet solder mask
*Final finishes
*Laminate thicknesses
*Low temperature solder
16:30-16:45 Q&A
16:45 Table Top Networking & End of Symposium

  • Price

    • Member rate:
      €75

      Cancellation Terms
      Cancellation until April 21, 2025: 50% refund.
      Cancellation after April 21 ,2025: No Refund.

Register online

Who is attending the symposium?

Jiva Materials
RHartley Enterprises
TaRiYa
Ventec International

Hotel & Symposium location:
Radisson Blu Scandinavia Hotel Copenhagen
Convendum Stockholm City AB +
Crystal Plaza Hotel Stockholm
Mercure Hotel Tallinn