EIPC Summer Conference Edinburgh, Jun 3-4

REVIEW FROM THE KEYNOTE SESSION BY PETE STARKEY

REVIEW CONFERENCE DAY 1 BY PETE STARKEY

We are delighted to announce the programme of the EIPC Summer Conference 2025, taking place on June 3rd and 4th in Edinburgh, Scotland.

This premier event will bring together industry experts, innovators, and thought leaders for 1.5 days of in-depth lectures and discussions on cutting-edge topics. As the capital of Scotland, Edinburgh offers a rich historical and cultural backdrop for our conference. Renowned for its stunning architecture, world-class universities, and vibrant technological sector, the city provides the perfect setting to foster innovation and collaboration.

Conference Day 1, Tuesday June 3
08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up Table Top & Sponsor Lounge
08:30-08:50 Welcome by the EIPC President EIPC, Alun Morgan, UK
Keynote Session 1: Business Outlook and New Opportunities
08:50-09:20 Business Outlook: Global Electronics Industry Alun Morgan obo, Custer Consulting, USA
09:20-09:40 Introduction to THPCA and the growth of the PCB manufacturing industry in Thailand Daniel Primett, Auromex, TH
09:40-10:00 Aligning Technological Evolution with Market Needs and Sustainability Objective Incap Corporation, Otto Pukk & Helena Maripuu , EE
10:00-10:10 Q&A
10:10-10:40 Coffee break & Table top Networking Sponsor Lounge
Session 2: Sustainability & Recycling
10:40-11:00 Circular Innovation and why materials matter: Building an environment for reverse electronics supply chains, recycling and repair – The Case of CIRC-UITS Project MacDermid Alpha Electronics Solutions, Chris Klok, NL
11:00-11:20 Sustainable, fully recyclable liquid metal PCBs for wireless applications Glasgow University, Xiaochuan Fang, UK
11:20-11:40 Sustainabiliy  & Circularity are key parameters for Chemistry choices for next generation electronic assemblies LiloTree, Dr. Kunal Shah, USA
11:40-11:50 Q&A
Session 3: From Microvias to Medical Implants: Materials and Processes Enabling Tomorrow’s Technologies
11:50-12:10 Advancements in Biocompatible Substrate Technology for Active Neurological Implants Dyconex, Vasco Duarte da Costa, CH
12:10-12:30 Enhanced Copper Plating Performance Using Novel High-Efficiency Plating System GreenSource, Gustavo Ramos, PL
12:30-12:50 An Update on Factors Effecting Crystallisation and Epitaxial Growth in Blind Micro Vias Atotech UK Ltd, Roger Massey, UK
12:50-13:00 Q&A
13:00-14:00 Networking Lunch Hotel Restaurant
14:00-14:30 Coffee break & Table top Networking Sponsor Lounge
Session 4: Towards a Circular Economy Industry: Materials and Manufacturing
14:30-15:00 Development of Sustainable Composites for PCB applications Jiva Materials, Dr. Erdem Selver, UK
15:00-15:30 Large-area manufacturing of printed board-level radio-frequency components with sustainable conductive polymers Glasgow University, Benjamin King, UK
15:30-15:50 European Implementation of an Enhanced Graphite-based Direct Metallization Process for Multi-layer PCB Production MacDermid Alpha Electronics Solutions, John Swanson, UK
15:50-16:00 Q&A
16:15 Departure from Delta Hotels by Marriott:  Guided tour @ Tasting @ Port Leith Distillery
19:00 Networking Dinner Port Leith Distillery
22:00 Return to Delta Hotels by Marriott
Conference Day 2, Wednesday June 4
Session 5: Enabling High-Density Integration: From Advanced HDI to Medical and Chiplet Substrates
09:00-09:20 Capabilities and Challenges in Taking the Step From HDI to Advanced HDI Atotech UK Ltd, Roger Massey, UK
09:20-09:50 High Density Substrates for Chiplet Technologies Fraunhofer IZM, Lars Böttcher, DE
09:50-10:10 Semi-Additive Plating Technology for Medical Applications Dyconex, David Capeder, CH
10:10-10:20 Q&A
10:20-11:00 Coffee break & Table top Networking Sponsor Lounge
Session 6: Insights on Thermal management and Waste water treatment
11:00-11:20 Overcoming Thermal Management Challenges in High Performance Devices MacDermid Alpha Electronics Solutions, Ian Stewart, UK
11:20-11:40 Waste water treatment Saita SRL, Carlo Enrico Martini, IT
11:40-11:50 Q&A
Session 7: Training on Surface Finish Processes
11:50-12:30 ENIG & ENEPIG Under the Microscope: Key Issues, Root Causes, and Best Practices LiloTree, Dr. Kunal Shah, USA
12:30-12:40 Q&A
12:40-12:45 Closing remarks by EIPC President Alun Morgan
12:45-14:00 Networking Lunch Hotel restaurant

Do you want to become a Summer Conference sponsor?

Download Sponsoring possibilities Conference Edinburgh 2025 to find out how you can increase your companies exposure for this event.

Hotel & conference location:
Delta Hotels by Marriott Edinburgh
111 Glasgow Road
Edinburgh, EH12 8NF

Hotel reservation link: Delta Hotel by Marriott

Social Programme June 3rd:
Guided tour, Tasting & Dinner
Port Leith Distillery

Who is attending the conference?

Adeon
Advantest Europe GmbH
Agfa Gevaert
Aspocomp
Atotech
Auromexx
CCI Eurolam
Cicor
Circuit Foil
Com.Int.El-ITEQ
Custer Consulting
Dyconex
E Hudson Technical Consultancy
FCDO
FED
Fineline Italy Srl
Fraunhofer IZM
Gen3
Greensource
HKPCA
Hofstetter PCB AG
I-Connect007
Ilfa
Incap Corporation
Incap Electronics
Intectiv d.o.o.
Jiva Materials
LiloTree
MacDermid Inc.
MacDermid Alpha Electronic Solutions
MSC Polymer AG
Polar Instruments Inc.
Polar Instruments Europe Ltd.
Polytron-Print GmbH
Saita SRL
Sun Chemical
TaRiYa Oy
Univeristy of Glasgow
Varioprint AG
Ventec Central Europe GmbH

  • Price
    • Member rate early bird:
      €600 Full Conference
    • Non-member rate early bird:
      € 780 Full Conference

      Cancellation Terms
      Cancellation until April 30, 2025: 50% refund.
      Cancellation after April 30 ,2025: No Refund.