EIPC Summer Conference – Jun 15-16, 2023

Review  Keynote by Pete Starkey I-Connect007

Review Day 1 by Pete Starkey I-Connect007

Review Day 2 by Pete Starkey I-Connect007

Programme EIPC Summer Conference Munich

Thursday and Friday 15th & 16th June, 2023

Conference Day 1, Thursday June 15
08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up Table Top & Sponsor Lounge
08:30-08:45 Welcome by the EIPC President Alun Morgan, EIPC, UK
Keynote Session 1: Business Outlook Moderator: Tarja Rapala-Virtanen, EIPC, FI
08:45-09:15 Business Outlook: Global Electronics Industry Alun Morgan obo Custer Consulting, USA
09:15-09:35 Interconnect Reliability in Electronic Systems Dr. Donkai Shangguan, Fellow – IEEE, IMAPS, USA
09:35-10:05 Supporting PCB supply chain under the EU chips act Stan Heltzel, ESTEC, The Netherlands
10:05-10:20 Q&A
10:20-10:50 Coffee break @ the Table top & Sponsor Lounge
Session 2: Smart Manufacturing (Industry 4.0) Moderator: Dr. Michele Stampanoni
10:50-11:10 Real Time Integration of Design-, and Production generated Process Results, CIMS AOI systems Andre Bodegom, Adeon-CIMS
11:10-11:30 Digital twin concept in Cu electroplating processes for better process control and superior metal finish Agnieszka Franczak, Elsyca, BE
11:30-11:50 A guide to converting existing European PCB Fab facilities to 100% ZLD/Green processing Alex Stępiński FRSA, Stepinski Group, USA
11:50-12:10 Advanced automated systems for fine-line and space requirements in HDI and package substrates Dirk Ruess and Andreas Schatz, Atotech Deutschland, DE
12:10-12:30 A new 3D finite element modeling approach to compute copper roughness supplementary loss in PCB. Benoit Wittmann, Circuit Foil, LU
12:30:12:40 Q&A
12:40-13:30 Lunch Restaurant Marriott Hotel
Session 3: Special Material Solutions Moderator: Emma Hudson, EHTC, UK
13:30-14:10 CCL Challenges in E-mobility applications Andreas Folge, NanYa Plastics, DE Volker Klafki, Technolam, DE
14:10-14:30 IMS Thermal Performance: The Secret’s in the Test Method Robert Art, Ventec Europe, DE
14:30-14:50 Development stable dielectric performance and low modulus CCL for Automotive Radar Application Yonghyon Kim, Doosan Corporation Electro Materials, KR
14:50-15:00 Q&A
15:15-16:30 Departure & Tour Group 1 to BMW World
15:15-16:30 Group 2 Networking Table Top & Sponsor Lounge Marriott Hotel
16:45-18:00 Departure Group 2 to BMW World
16:45-18:00 Group 1 Networking Table Top & Sponsor Lounge Marriott Hotel
19:00-22:00 Departure Marriott Hotel Lobby – Networking Dinner
Conference Day 2, Friday June 16
Session 4: Supply Chain and Metrology Moderator: Oldrich Simek, Pragoboard, CZ
08:30-08:50 The Bullwhip effect, from crises to crises Gerd Appelt, Göttle GmbH. DE
08:50-09:10 General UL update Emma Hudson, EHTC, UK
09:10-09:30 Metrology for Advanced PCB and ICS Manufacturing Uwe Altmann, KLA-Orbotech, BE
09:30-09:50 Smart Design – sustainable solution for automated and optimized Cu balancing Agnieszka Franczak, Elsyca, BE
09:50-10:05 Q&A
10:05-10:35 Coffee Break @ Table Top & Sponsor Lounge
Session 5: Solder Mask applications and Surface Finishes Moderator: John Fix, Taiyo America, USA
10:35-10:55 Application for Digital Ink Jet Printing of Solder Mask for Flex Cirquits Hans Fritz, SAT, DE
10:55-11:15 Next Generation Solder Mask for Automotive Harald Kutzias, Taiyo America, USA
11:15-11:35 Selection Criteria of Surface Finishes for Better Reliability of Next Generation Electronic Assemblies Dr. Kunal Shah, LiloTree, USA
11:35-11:50 Q&A
Session 6: Roadmapping PCB Technology Moderator: Alun Morgan, EIPC, UK
11:50-12:50 PCB Technology in the iNEMI Roadmap Dr. Francis Mullany, iNEMI, UK

Tarja Rapala-Virtanen, EIPC, FI

12:50-14:00 Lunch Restaurant Marriott Hotel
  • Price

    • MEMBER : € 600 Full Conference
    • NON-MEMBER : € 780 Full Conference

Who is attending the conference in Munich?

Agfa Gevaert
ahk Service & Solutions
Blendl GmbH
BMK Professional Electronics GmbH
BMW Group
CCI Eurolam
Circuit Foil
Com.Int. El/ITEQ
Custer Consulting
Dr. Ing Max Schloetter GmbH
Doosan Corporation Electro Materials Europe
Emma Hudson TC
Electra Polymers
Elga Europe
Gatema PCB as
Huntsman Materials
Ilfa GmbH
Isola GmbH
Lackwerke Peters
MacDermid Alpha
MEC Europe
NanYa Plastics
Notion Systems
PCB Connect GmbH
Polar Instruments
Schmoll Maschinen
Stepinksi Group
Taiyo America
Ventec Europe

Conference location:
Munich Marriott Hotel
Berliner Strasse 93
Munich 80805, Germany

Visit June 15th:
BMW World Munich