EIPC Summer Conference – Jun 15-16, 2023

Programme EIPC Summer Conference Munich

Thursday and Friday 15th & 16th June, 2023

Conference Day 1, Thursday June 15
08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up Table Top & Sponsor Lounge
08:30-08:45 Welcome by the EIPC President Alun Morgan, EIPC, UK
Keynote Session 1: Business Outlook Moderator: Tarja Rapala-Virtanen, EIPC, FI
08:45-09:15 Business Outlook: Global Electronics Industry Alun Morgan obo Custer Consulting, USA
09:15-09:35 Interconnect Reliability in Electronic Systems Dr. Donkai Shangguan, Fellow – IEEE, IMAPS, USA
09:35-10:05 Supporting PCB supply chain under the EU chips act Stan Heltzel, ESTEC, The Netherlands
10:05-10:20 Q&A
10:20-10:50 Coffee break @ the Table top & Sponsor Lounge
Session 2: Smart Manufacturing (Industry 4.0) Moderator: Dr. Michele Stampanoni
10:50-11:10 Real Time Integration of Design-, and Production generated Process Results, CIMS AOI systems Andre Bodegom, Adeon-CIMS
11:10-11:30 Digital twin concept in Cu electroplating processes for better process control and superior metal finish Agnieszka Franczak, Elsyca, BE
11:30-11:50 A guide to converting existing European PCB Fab facilities to 100% ZLD/Green processing Alex Stępiński FRSA, Stepinski Group, USA
11:50-12:10 Advanced automated systems for fine-line and space requirements in HDI and package substrates Dirk Ruess and Andreas Schatz, Atotech Deutschland, DE
12:10-12:30 A new 3D finite element modeling approach to compute copper roughness supplementary loss in PCB. Benoit Wittmann, Circuit Foil, LU
12:30:12:40 Q&A
12:40-13:30 Lunch Restaurant Marriott Hotel
Session 3: Special Material Solutions Moderator: Emma Hudson, EHTC, UK
13:30-14:10 CCL Challenges in E-mobility applications Andreas Folge, NanYa Plastics, DE Volker Klafki, Technolam, DE
14:10-14:30 IMS Thermal Performance: The Secret’s in the Test Method Robert Art, Ventec Europe, DE
14:30-14:50 Development stable dielectric performance and low modulus CCL for Automotive Radar Application Yonghyon Kim, Doosan Corporation Electro Materials, KR
14:50-15:00 Q&A
15:15-16:30 Departure & Tour Group 1 to BMW World
15:15-16:30 Group 2 Networking Table Top & Sponsor Lounge Marriott Hotel
16:45-18:00 Departure Group 2 to BMW World
16:45-18:00 Group 1 Networking Table Top & Sponsor Lounge Marriott Hotel
19:00-22:00 Departure Marriott Hotel Lobby – Networking Dinner
Conference Day 2, Friday June 16
Session 4: Supply Chain and Metrology Moderator: Oldrich Simek, Pragoboard, CZ
08:30-08:50 The Bullwhip effect, from crises to crises Gerd Appelt, Göttle GmbH. DE
08:50-09:10 General UL update Emma Hudson, EHTC, UK
09:10-09:30 Metrology for Advanced PCB and ICS Manufacturing Uwe Altmann, KLA-Orbotech, BE
09:30-09:50 Smart Design – sustainable solution for automated and optimized Cu balancing Agnieszka Franczak, Elsyca, BE
09:50-10:05 Q&A
10:05-10:35 Coffee Break @ Table Top & Sponsor Lounge
Session 5: Solder Mask applications and Surface Finishes Moderator: John Fix, Taiyo America, USA
10:35-10:55 Application for Digital Ink Jet Printing of Solder Mask for Flex Cirquits Hans Fritz, SAT, DE
10:55-11:15 Next Generation Solder Mask for Automotive Harald Kutzias, Taiyo America, USA
11:15-11:35 Selection Criteria of Surface Finishes for Better Reliability of Next Generation Electronic Assemblies Dr. Kunal Shah, LiloTree, USA
11:35-11:50 Q&A
Session 6: Roadmapping PCB Technology Moderator: Alun Morgan, EIPC, UK
11:50-12:50 PCB Technology in the iNEMI Roadmap Dr. Francis Mullany, iNEMI, UK

Tarja Rapala-Virtanen, EIPC, FI

12:50-14:00 Lunch Restaurant Marriott Hotel
  • Price

    • MEMBER : € 600 Full Conference
    • NON-MEMBER : € 780 Full Conference

Who is attending the conference in Munich?

Adeon-CIMS
Agfa Gevaert
ahk Service & Solutions
Amphenol
Aspocomp
Atotech
Blendl GmbH
CCI Eurolam
Cicor
Cicruibras
Circuit Foil
Com.Int. El/ITEQ
Custer Consulting
Doosan Corporation Electro Materials Europe
Dyconex
Emma Hudson TC
Electra Polymers
Elga Europe
Elsyca
Eltos
ESA/ESTEC
Gatema PCB as
Goettle
Huntsman Materials
I-Connect007
IMAPS
iNEMI
Isola GmbH
KLA-Orbotech
Kubatronik
Lackwerke Peters
LiloTree
MacDermid Alpha
MEC Europe
NanYa Plastics
Notion Systems
PLUS
Polar Instruments
Pragoboard
Printprocess
Rogers
RS-PCB Solutions
SAT
Schmoll Maschinen
Stepinksi Group
Taiyo America
TaRiYa
Technolam
TTM
Ucamco
Ventec Europe

Conference location:
Munich Marriott Hotel
Berliner Strasse 93
Munich 80805, Germany

Visit June 15th:
BMW World Munich