| Conference Day 1, Thursday June 15 |
|
| 08:00-08:30 |
Conference Registration and Table Top & Poster Exhibition build up |
Table Top & Sponsor Lounge |
| 08:30-08:45 |
Welcome by the EIPC President |
Alun Morgan, EIPC, UK |
| Keynote Session 1: Business Outlook |
Moderator: Tarja Rapala-Virtanen, EIPC, FI |
| 08:45-09:15 |
Business Outlook: Global Electronics Industry |
Alun Morgan obo Custer Consulting, USA |
| 09:15-09:35 |
Interconnect Reliability in Electronic Systems |
Dr. Donkai Shangguan, Fellow – IEEE, IMAPS, USA |
| 09:35-10:05 |
Supporting PCB supply chain under the EU chips act |
Stan Heltzel, ESTEC, The Netherlands |
| 10:05-10:20 |
Q&A |
|
| 10:20-10:50 |
Coffee break @ the Table top & Sponsor Lounge |
|
| Session 2: Smart Manufacturing (Industry 4.0) |
Moderator: Dr. Michele Stampanoni |
| 10:50-11:10 |
Real Time Integration of Design-, and Production generated Process Results, CIMS AOI systems |
Andre Bodegom, Adeon-CIMS |
| 11:10-11:30 |
Digital twin concept in Cu electroplating processes for better process control and superior metal finish |
Agnieszka Franczak, Elsyca, BE |
| 11:30-11:50 |
A guide to converting existing European PCB Fab facilities to 100% ZLD/Green processing |
Alex Stępiński FRSA, Stepinski Group, USA |
| 11:50-12:10 |
Advanced automated systems for fine-line and space requirements in HDI and package substrates |
Dirk Ruess and Andreas Schatz, Atotech Deutschland, DE |
| 12:10-12:30 |
A new 3D finite element modeling approach to compute copper roughness supplementary loss in PCB. |
Benoit Wittmann, Circuit Foil, LU |
| 12:30:12:40 |
Q&A |
|
| 12:40-13:30 |
Lunch |
Restaurant Marriott Hotel |
| Session 3: Special Material Solutions |
Moderator: Emma Hudson, EHTC, UK |
| 13:30-14:10 |
CCL Challenges in E-mobility applications |
Andreas Folge, NanYa Plastics, DE Volker Klafki, Technolam, DE |
| 14:10-14:30 |
IMS Thermal Performance: The Secret’s in the Test Method |
Robert Art, Ventec Europe, DE |
| 14:30-14:50 |
Development stable dielectric performance and low modulus CCL for Automotive Radar Application |
Yonghyon Kim, Doosan Corporation Electro Materials, KR |
| 14:50-15:00 |
Q&A |
|
| 15:15-16:30 |
Departure & Tour Group 1 to BMW World |
| 15:15-16:30 |
Group 2 Networking Table Top & Sponsor Lounge Marriott Hotel |
| 16:45-18:00 |
Departure Group 2 to BMW World |
| 16:45-18:00 |
Group 1 Networking Table Top & Sponsor Lounge Marriott Hotel |
| 19:00-22:00 |
Departure Marriott Hotel Lobby – Networking Dinner |
|
|
|
|
|
|
|
|
|
|
|
| Conference Day 2, Friday June 16 |
|
| Session 4: Supply Chain and Metrology |
Moderator: Oldrich Simek, Pragoboard, CZ |
| 08:30-08:50 |
The Bullwhip effect, from crises to crises |
Gerd Appelt, Göttle GmbH. DE |
| 08:50-09:10 |
General UL update |
Emma Hudson, EHTC, UK |
| 09:10-09:30 |
Metrology for Advanced PCB and ICS Manufacturing |
Uwe Altmann, KLA-Orbotech, BE |
| 09:30-09:50 |
Smart Design – sustainable solution for automated and optimized Cu balancing |
Agnieszka Franczak, Elsyca, BE |
| 09:50-10:05 |
Q&A |
|
| 10:05-10:35 |
Coffee Break @ Table Top & Sponsor Lounge |
|
| Session 5: Solder Mask applications and Surface Finishes |
Moderator: John Fix, Taiyo America, USA |
| 10:35-10:55 |
Application for Digital Ink Jet Printing of Solder Mask for Flex Cirquits |
Hans Fritz, SAT, DE |
| 10:55-11:15 |
Next Generation Solder Mask for Automotive |
Harald Kutzias, Taiyo America, USA |
| 11:15-11:35 |
Selection Criteria of Surface Finishes for Better Reliability of Next Generation Electronic Assemblies |
Dr. Kunal Shah, LiloTree, USA |
| 11:35-11:50 |
Q&A |
|
| Session 6: Roadmapping PCB Technology |
Moderator: Alun Morgan, EIPC, UK |
| 11:50-12:50 |
PCB Technology in the iNEMI Roadmap |
Dr. Francis Mullany, iNEMI, UK
Tarja Rapala-Virtanen, EIPC, FI |
| 12:50-14:00 |
Lunch |
Restaurant Marriott Hotel |
