EIPC Summer Conference – Jun 14-15, 2022

REVIEW CONFERENCE DAY 2 BY PETE STARKEY ICONNECT-007

REVIEW CONFERENCE DAY 1 BY PETE STARKEY ICONNECT -007
Conference Programme Day 1, Tuesday June 14th

08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up
08:30-09:00 Welcome by the EIPC President Alun Morgan, EIPC, UK

Keynote Session 1: Market Outlook & New Business Opportunities
09:00-09:40 Business Outlook: Global Electronics Industry, Alun Morgan obo Custer Consulting, USA
09:40-10:20 The Challenges of the 2022 PCB Market  Dr. Shiuh-Kao Chiang, Prismark, USA
10:20-10:30 Panel discussion

Session 2: Technology Roadmap and Technical Requirments
10:30-10:50 Setting the trends and requirements for 6G PCB manufacturing, Stig Källman, Ericsson, SE
10:50-11:10 Shift-left makes your PCB design right! Robrecht Belis, Elsyca, BE
11:10-11:40 30 minutes Coffee break
11:40-12:00 The European Space Agency’s approach to microvia reliability, Stan Heltzel, ESA, NL
12:00-12:20 Stop resistance from clouding your high speed measurements, Martyn Gaudion, Polar, UK
12:20-12:35 Panel discussion

12:35-13:30 Network Lunch

Session 3: Material Technology for Next Generation Products
13:30-13:50 Comparative Testing of Insertion Loss Performance on Printed Circuit Boards,
Alexander Ippich, Isola, DE
13:50-14:10 Enablers for mm Wave PCBs: Base Materials with High Electrical and Mechanical Reliability,
Dr. Manfred Huschka, AGC, JP
14:10-14:30 Laminates for high-tech requirements: the example of 5G, Andreas Folge, NanYa, DE
14:30-14:50 The New High RC Construction to Improve PCB Insertion Loss, Alan Cochrane, ITEQ
14:50-15:00 Panel discussion
15:00-15:10 Info & Logisitics Plant visit Ericsson, Christer Nykom, Ericsson, SE

16:00-19:00 Departure & Visit Ericsson Kumla
19:3
0 Network Dinner Restaurant Frimis Salonger Örebro
22:
30 Return Hotel Scandic Grande Örebro

Conference Programme Day 2, Wednesday June 15th                  

Session 4: New Process Technologies
09:00-09:20 Additive, digital processes in electronics manufacturing, Dr. Kai J. Keller, Notion Systems, DE
09:20-09:40 Novel Ni-free surface finish for next generation PCB technologies, Dr. Kunal Shah, LiloTree US
09:40-10:00 ALD thin film as barrier on PCB and PCBA assemblies, Marko Pudas, Picosun, FI
10:00-10:15 Panel discussion

10:15-10:45 30 minutes Coffee break

Session 5: Manufacturing Technologies
10:45-11:05 Towards the next generation of ultra-flat ED-copper foils for high speed digital & radio frequency applications, Sébastien Depaifve, Circuit Foil, BE
11:05-11:25 Reliability and Loss Properties of Copper Foil for 5G Applications, iNEMI, Jim Francey, Isola Group, UK
11:25-11:45 New material which could be used a bonding film for Teflon Multilayer, Helmut Kroener, HKC, DE
11:45-12:05 DryPhase Patterning (DPP) – a new technology to disrupt flexible circuit board manufacturing, Tommy Höglund, DP Pattering, SE
12:05-12:20 Panel discussion

12:20-12:25 President closing remarks – End of Conference Day 2
12:25-13:30
Network Lunch

The EIPC is not responsible for the content and the presentation of the technical papers, which rests with the presenters. Changes in the programme may occur, due to circumstances, for which the EIPC may not be held responsible.

  • Price

    • MEMBERS : € 725 Late Full Conference
    • NON-MEMBERS : € 900 Late Full Conference

Who is attending the conference in Örebro?

Adeon
AGC Multi Material Europe
Aspocomp Group Oyi
ASS-Luippold e.K.
CCI-Eurolam SA
Circuit Foil Luxembourg
Comintel / ITEQ
Custer Consulting
Doosan Corporation
DP Patterning
Dyconex AG
Electra Polymers
Elec & Eltek
Elga Europe SRL
Elsyca
Ericsson AB
ESA European Space Agency
iNEMI
Isola
ITEQ
LiloTree
m.art preserving GmbH
MacDermid Enthone
Naavinya CAD Soft Pvt. Ltd.
NCAB Group Sweden AB
NanYa Plastics Corporation
Notion Systems
KLA-Orbotech
PCB Connect
Picosun
Polar Instruments
Pragoboard
Printprocess AG
Prismark
PWB Interconnect Solutions
Rogers Corporation
RS-PCB Solutions
Sanmina-SCI Holding
Schweizer Electronic AG
Showa Denko Materials
Taiyo America
Technolam GmbH
Teltonika EMS
TTM
Ucamco NV
UL LLC
Unimicron Germany GmbH
Varioprint
Ventec Europe
WUS Printed Circuits

Conference location:
Scandic Grand Örebro
Fabriksgatan 21-23
Örebro, Sweden
T: +46 19 7674300

www.scandichotels.com/hotels/sweden/orebro

Please book your hotel room via the website Scandic Grand Örebro | Hotel in Orebro | Scandic Hotels or via phone Tel: 0046-851751700.
Please use the booking code BEIP130622 for both website and call center.
The blocked rooms for EIPC will be released on the 13th May, request after that is subject to availability and daily rate.

Please find herewith a travel guidance by plane, train or bus to Örebro, Sweden.

Travel to Orebro

 

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