REVIEW CONFERENCE DAY 2 BY PETE STARKEY ICONNECT-007
REVIEW CONFERENCE DAY 1 BY PETE STARKEY ICONNECT -007
Conference Programme Day 1, Tuesday June 14th
08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up
08:30-09:00 Welcome by the EIPC President Alun Morgan, EIPC, UK
Keynote Session 1: Market Outlook & New Business Opportunities
09:00-09:40 Business Outlook: Global Electronics Industry, Alun Morgan obo Custer Consulting, USA
09:40-10:20 The Challenges of the 2022 PCB Market Dr. Shiuh-Kao Chiang, Prismark, USA
10:20-10:30 Panel discussion
Session 2: Technology Roadmap and Technical Requirments
10:30-10:50 Setting the trends and requirements for 6G PCB manufacturing, Stig Källman, Ericsson, SE
10:50-11:10 Shift-left makes your PCB design right! Robrecht Belis, Elsyca, BE
11:10-11:40 30 minutes Coffee break
11:40-12:00 The European Space Agency’s approach to microvia reliability, Stan Heltzel, ESA, NL
12:00-12:20 Stop resistance from clouding your high speed measurements, Martyn Gaudion, Polar, UK
12:20-12:35 Panel discussion
12:35-13:30 Network Lunch
Session 3: Material Technology for Next Generation Products
13:30-13:50 Comparative Testing of Insertion Loss Performance on Printed Circuit Boards,
Alexander Ippich, Isola, DE
13:50-14:10 Enablers for mm Wave PCBs: Base Materials with High Electrical and Mechanical Reliability,
Dr. Manfred Huschka, AGC, JP
14:10-14:30 Laminates for high-tech requirements: the example of 5G, Andreas Folge, NanYa, DE
14:30-14:50 The New High RC Construction to Improve PCB Insertion Loss, Alan Cochrane, ITEQ
14:50-15:00 Panel discussion
15:00-15:10 Info & Logisitics Plant visit Ericsson, Christer Nykom, Ericsson, SE
16:00-19:00 Departure & Visit Ericsson Kumla
19:30 Network Dinner Restaurant Frimis Salonger Örebro
22:30 Return Hotel Scandic Grande Örebro
Conference Programme Day 2, Wednesday June 15th
Session 4: New Process Technologies
09:00-09:20 Additive, digital processes in electronics manufacturing, Dr. Kai J. Keller, Notion Systems, DE
09:20-09:40 Novel Ni-free surface finish for next generation PCB technologies, Dr. Kunal Shah, LiloTree US
09:40-10:00 ALD thin film as barrier on PCB and PCBA assemblies, Marko Pudas, Picosun, FI
10:00-10:15 Panel discussion
10:15-10:45 30 minutes Coffee break
Session 5: Manufacturing Technologies
10:45-11:05 Towards the next generation of ultra-flat ED-copper foils for high speed digital & radio frequency applications, Sébastien Depaifve, Circuit Foil, BE
11:05-11:25 Reliability and Loss Properties of Copper Foil for 5G Applications, iNEMI, Jim Francey, Isola Group, UK
11:25-11:45 New material which could be used a bonding film for Teflon Multilayer, Helmut Kroener, HKC, DE
11:45-12:05 DryPhase Patterning (DPP) – a new technology to disrupt flexible circuit board manufacturing, Tommy Höglund, DP Pattering, SE
12:05-12:20 Panel discussion
12:20-12:25 President closing remarks – End of Conference Day 2
12:25-13:30 Network Lunch
The EIPC is not responsible for the content and the presentation of the technical papers, which rests with the presenters. Changes in the programme may occur, due to circumstances, for which the EIPC may not be held responsible.
