EIPC Summer Conference ESA-ESTEC, Jun 4-5, 2024

Review conference Part 1/3-Day 1 Pete Starkey Technical Services
Review conference Part 2/3-Day 1 Pete Starkey Technical Services
Review conference Part 3/3 Day 2 Pete Starkey Technical Services

Conference Day 1, Tuesday June 4
08:00-09:15 Group 1: Departure from Fletcher Hotel by bus to ESA-ESTEC + Onsite Registration
08:30-09:45 Group 2: Departure from Fletcher Hotel by bus to ESA-ESTEC + Onsite Registration
09:00-10:00 Conference Registration & Welcome Coffee & Tea in the Foyer
10:00-10:20 Welcome by the EIPC President Alun Morgan, EIPC, UK
10:20-10:25 Welcome by ESA-ESTEC ESA-ESTEC, Stan Heltzel, NL
Keynote Presentation: Business Outlook in Room “Newton” Moderator: Tarja Rapala-Virtanen, EIPC, FI
10:25-10:55 Business Outlook: Global Electronics Industry Alun Morgan obo, Custer Consulting, USA
Session 1: Next Generation PCB Technology Capability Development and Standardization Moderator: Tarja Rapala-Virtanen, EIPC, FI
10:55-11:15 Advancing PCB technology for European Space Applications ESA-ESTEC, Stan Heltzel, NL
11:15-11:35 UHDI vs IC Substrates – Standards and Capabilities NCAB Group, Jan Pedersen, NO
11:35-11:55 Silicon-to-Systems: New ways to approach Electronic Design IPC, Dr. Peter Tranitz, DE
11:55-12:05 Q&A
12:05-12:35 Coffee break & Table top Networking
Session 2: Innovative Development of PCB Technology and Design Moderator: Dr. Michele Stampanoni, Cicor Group, CH
12:35-12:55 Functionalizing printed circuit boards by introducing alternative metals through sputtered layers Dyconex AG, Dr. Evelyne Parmentier, CH
12:55-13:15 Tackling the future PCB demands Nextgin Technology BV, Joan Tourné, NL
13:15-13:25 Q&A
13:25-14:25 Networking Lunch Cafeteria ESA-ESTEC
Session 3: Environmental Aspects on PCB Technology Development Moderator: Stan Heltzel, ESA-ESTEC, NL
14:25-14:45 A parametric approach to quantifying the environmental impact of PCB manufacturing IMEC, Dr. Ir. Maarten Cauwe, BE
14:45-15:05 The worlds first Biodegradable PCB substrate Jiva Materials, Steve Driver, UK
15:05-15:25 Carbon based Direct Metalization Reliability MacDermid, John Swanson, USA
15:25-15:35 Q&A
15:45 Departure walk from ESA-ESTEC to Space Expo
16:00-16:15 Welcome for all Groups @ Space Station Square
16:15-17:15 Guided tour Space Expo Group A + Group B
16:15-17:15 Free walk around Museum Group C + Group D
17:15-18:15 Guided tour Space Expo Group C + Group D
17:15-18:15 Free walk around Museum Group A + Group B
18:15-22:00 Departure by bus Networking Dinner Beach Restaurant De Zeemeeuw
Conference Day 2, Wednesday June 5
08:00 All delegates: Departure from Fletcher Hotel by bus to ESA-ESTEC
08:15-08:30 Welcome Coffee & Tea in the Foyer
Session 4: Material Studies in Room “Newton” Moderator: Martyn Gaudion, Polar Instruments, UK
08:30-08:50 Qualitative Analysis of Crack Formation in Thermally Aged Glass Fiber Reinforced Polymer Printed Circuit Boards Robert Bosch, Mandy Krott, DE
08:50-09:10 Sustainability Through Innovation: Exploring Printed Electronics for Next-Gen Devices Tampere University, Karem Lozano Monte, FI
09:10-09:20 Q&A
Session 5: Electrical Performance of PCB Materials Moderator: Emma Hudson, EHTC, UK
09:20-09:40 Newly developed methodologies to boost Copper Clad Laminate electrical performance ITEQ / Com. Int. El, Marco Cereda, IT
09:40-10:00 Last update on correlation between copper foil surface conductivity and roughness Circuit Foil, Thomas Devahif, LU
10:00-10:10 Q&A
10:10-10:40 Coffee break & Table top Networking
Session 6: Improve Design Capabilities by using Software Standardisation Moderator: Tarja Rapala-Virtanen, EIPC, FI
10:40-11:00 PCB_Design_Using_IPC_Standard (2221-2222) Novatrace, Richard Prent, NL
11:00-11:20 AFNOR SPEC 2212 – Printed circuit board – layout parameters Thales, Christian Maudet, FR
11:20-11:30 Q&A
11:30-12:10 Coffee break & Table top Networking
12:10-12:55 Quick Fire Walk In Moderator: Alun Morgan, EIPC, UK
Polar Instruments, IMEC, Emma Hudson Technical Consultancy
12:55-13:00 Closing remarks by EIPC President Mr. Alun Morgan
13:00-14:00 Networking Lunch Cafeteria ESA-ESTEC
14:00 Departure bus to Fletcher Wellness Hotel Leiden

Do you want to become a Summer Conference sponsor?

Download Sponsoring possibilities Conference ESTEC 2024 to find out how you can increase your companies exposure for this event.

  • Price

    • Member rate from May 4th:
      €620 Full Conference
    • Non-member rate from May 4th:
      € 795 Full Conference

Who is attending the conference?

ABM Asset and Business Management AG
ahk Service & Solutions GmbH
ASS Luippold
AWOS s.r.o.
CCI Eurolam
Cicor Group
Circuit Foil
Cistelaier SpA
Custer Consulting
Elco SpA
Electra Polymers
Elga Europe
Elinta Robotics
Eltos SpA
Emma Hudson Technical Consultancy
Fuba Printed Circuits Tunesia
Gredmann Group
Hofstetter PCB AG
Ilfa GmbH
Isola Group
Jiva Materials
MacDermid Alpha Electronics Solutions
MEC Europe
Miva Technologies
Nextgin Technology
Panasonic Industrial Devices Materials Europe
Peters Research GmbH
Polar Instruments
PragoBoard s.r.o.
Robert Bosch
Rogers Corporation
RS-PCB Solutions
Schmoll Maschinen GmbH
Schweizer Electronic AG
Starkey Technical Services
SUSS MicroTec Netherlands
Tampere University
TaRiYa Oy
TTM Technologies
Thales France
Thales Alenia Space Belgium
Ventec Europe

Fletcher Wellness Hotel Leiden 4*
€ 139.- p. night including breakfast
Booking Reference code: 113-GFC4321

Hotel rooms will be released on May 4.  After this date reservations are on availability. 

Conference location:
ESA/ESTEC European Space Agency

Visit June 4th:
Space Expo Noordwijk

Dinner June 4th Restaurant:
Strandpaviljoen De Zeemeeuw