EIPC Technical Snapshot Webinar – 2nd July 2026
We are pleased to announce our upcoming webinar:
“PCB Economic Outlook; How AI Infrastructure build-out is disrupting the global PCB materials supply chain” scheduled for July 2nd.
The session will feature Alun Morgan, Technology Ambassador at Ventec Europe and CTO at Jiva Materials delivering a 30-minute presentation under the theme “PCB Economic Outlook; How AI Infrastructure build-out is disrupting the global PCB materials supply chain.”
15:00 CET
Introduction EIPC
15:03 CET
Speaker: Alun Morgan, Technology Ambassador Ventec and CTO Jiva Materials
15:30 CET
Q&A
The webinar will conclude with an interactive Q&A session, providing attendees with the opportunity to engage directly with the speaker and address their questions.
May we please invite you to join us, this is free for EIPC members, but for non-members it is just € 50.-.

