EIPC Technical Snapshot Webinar – Jan 19, 2022

REVIEW BY PETE STARKEY ICONNECT007
WEDNESDAY 19th January @ 14.00 hrs CET

There will again be three speakers, and the opportunity to have your questions answered before the conclusion.
14.00 hrs
Didrik Bech from Elmatica:
“Where are you in the PCB supply chain, and how are you affected by defense regulations”
14.15 hrs
Stan Heltzel of the European Space Agency will illustrate:
“The European Space Agency’s approach to microvia reliability”
Abstract:
The recent revision of European space standards on PCB design, qualification and procurement include design margin to mitigate risks of latent short-circuit and open-circuit failures, as well as novel test and inspection methods for qualification and for lot conformance, such as temperature humidity bias test, conductive anodic filament test, interconnect stress test and dark-field microscopy. The test methods are used to benchmark technology from ESA-qualified PCB manufacturers, and to qualify high-density interconnect (HDI) technology including microvias. To investigate the reliability of the advanced manufacturing methods, various traditional and accelerated thermal stress tests are performed on two and three layers of staggered and stacked microvia configurations, as well as the thermo-mechanical modelling of stress factors.
14.30 hrs
Liisa Hakola from VTT Technical Research Centre of Finland Ltd:
“Sustainability creates new opportunities for electronics industry”
Abstract:
European and Global environmental agendas force electronics industry to rethink its environmental impact. Sustainability, environmental and circular economy goals expect that more durable products are designed and manufactured, renewable materials are used in their manufacturing without generating extensive manufacturing waste, and products are reused, recycled or repaired efficiently. Electronics industry can specifically decrease its environmental burden by shifting from fossil-based materials to bio-based materials, decreasing use of metals, and utilizing printing based additive manufacturing processes. VTT has used sustainability approach to develop new electronic functionalities with minimal environmental impact. This presentation will highlight the opportunities and challenges for sustainable electronic products.
14.45 hrs Q&A
To ensure your place on this topically important Webinar, register online or contact us at eipc@eipc.org
For EIPC members the webinar is free of charge; for non-members the fee is € 50,-.
  • Price

    • MEMBERS (regular): FREE OF CHARGE
    • NON-MEMBERS (regular): € 50,-
 

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