A headline in a Sunday newspaper caught the eye – “Now, more than ever, we need to talk”.
Better communication with colleagues can help in these turbulent times. Manufacturing industry continues, in spite of all the obstacles, and the need to keep informed has not lessened. Thus it is that EIPC have decided to run another technical webinar, and this will be held on 20th January 2021 at 15:00 hours CET.
There will again be three speakers, and the opportunity to have your questions answered before the conclusion.
Moderated by our Chairman Alun Morgan, we will hear initially from Walt Custer, who needs no introduction. In a 40-minute presentation, Walt will provide a Business Outlook for the Global Electronics Industry – with the emphasis on Europe.
From AT&S In Austria, Herr Erich Schlaffer will, over 15 minutes, hold up for inspection 5GmmWave which is a fundamental transformation in the Packaging & Substrate world with a high impact to existing PCB interconnection technology.
From Taiyo the always affable Don Monn will devote quarter of an hour to show how we may finally capture the holy grail of solder mask. The next step is right in front of us all – we just need the courage to take the step that is presenting itself. Don will explain all.
Abstract: Soldermask is a necessity that has been around for a very long time. It has evolved several times over the decades and continues its evolution even today. We’ve been updated on the current growth of Inkjet Soldermask, but how did we get to this point? Today we will see and hear how Soldermask has changed to meet the growing demands over the past 4 decades. Who is driving these changes and where will it all lead? When will we finally capture the holy grail of Soldermask, or will we ever? The next step is right in front of us all. We just need the courage to take the step that is presenting itself.
There will be a Q&A session after the last speaker.