EIPC Technical Snapshot Webinar – June 16, 2021

WEDNESDAY 16th JUNE @ 15.00 hrs CET

Please join us for our 9th Technical snapshot Webinar.

We will have four speakers:- William Bowerman from MacDermid Enthone will give an insight on Cleaning of Microvia Target Pads. From Atotech Ltd. we will hear from Sebastian Zarwell who will talk about Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures.

Maarten Cauwe from iMEC will look at the Challenges in microvia design, modeling and testing. And finally it will be down to Jason Furlong from PWB Interconnect Solutions who will inform us on IPC/IMEC/ESA testing.

Moderator: Tarja Rapala-Virtanen

15:00 CET
“Cleaning of Microvia Target Pads”
Speaker: William Bowerman, MacDermid Enthone.

15:15 CET
‘Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures’
Speaker: Sebastian Zarwell, Atotech Ltd.

15:30 CET
‘Challenges in microvia design, modeling and testing’
Speaker: Maarten Cauwe, IMEC Belgium

15:45 CET
‘IPC/IMEC/ESA testing’
Speaker: Jason Furlong, PWB Interconnect Solutions
16:00 Q&A All Speakers
Each speaker will speak for 15 minutes and we will end again with a Q&A.
To ensure your place on this topically important Webinar, please contact us NOW.
For EIPC members the webinar is free of charge; for non-members the fee is € 50,-.
  • Price

    • MEMBERS (regular): FREE OF CHARGE
    • NON-MEMBERS (regular): € 50,-

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