EIPC Technical Snapshot Webinar – June 16, 2021
Review by Pete Starkey from I-Connect007
WEDNESDAY 16th JUNE @ 15.00 hrs CET
Please join us for our 9th Technical snapshot Webinar.
We will have four speakers:- William Bowerman from MacDermid Enthone will give an insight on Cleaning of Microvia Target Pads. From Atotech Ltd. we will hear from Sebastian Zarwell who will talk about Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures.
Maarten Cauwe from iMEC will look at the Challenges in microvia design, modeling and testing. And finally it will be down to Jason Furlong from PWB Interconnect Solutions who will inform us on IPC/IMEC/ESA testing.
Moderator: Tarja Rapala-Virtanen
‘Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures’
Speaker: Sebastian Zarwell, Atotech Ltd.
Speaker: Maarten Cauwe, IMEC Belgium