EIPC Technical Snapshot Webinar – November 18, 2020
Review Technical Snapshot Webinar by Pete Starkey I-Connect007
An EIPC Webinar is just like one of their Conference, except that you do not have to travel, you do not have a beer with colleagues, you do not enjoy excellent food, and you do not enjoy convivial company. But we do not live in normal times, and some things are not the same. Manufacturing PCBs, however, remains comfortingly complex, and so on
18th November 2020 at 1500 hours CEST
EIPC will hold a Webinar at which three very reassuring gentlemen will help matters become a little clearer.
In the 45-minute session, moderated by our Chairman Alun Morgan, we will hear from PRISMARK Dr. SHIUH-KAO CHIANG, who will show how the pandemic has substantially distorted PCB production patterns and demand expectations. He will reflect on the 2020 PCB market and discuss the various key factors that drive or alter the market momentum.
2020 is a year to remember. This is probably the first time that the global electronics and PCB industries are deeply impacted by an infectious disease. Furthermore, the pandemic has substantially distorted PCB production patterns and demand expectations. As a result, the 2020 PCB market is very different from originally anticipated. In this presentation, Prismark will present its views on the 2020 PCB market and discuss the various key factors that drive or alter the market momentum.
MIKE VINSON from Averatek will look at how the availability of thinner high-performance materials brings many advantages to board layout and design without affecting impedance requirements.
The trace size on today’s high speed circuits are often limited by impedance matching and dielectric thickness. Semi-Additive PCB fabrication enabling smaller, more accurate traces with straighter more precise trace sidewalls in combination with the availability of thinner high-performance materials bring many advantages to board layout and design without affecting impedance requirements. This presentation will discuss the A-SAP™ process and its impact on signal integrity and PCB design.
From ROLAND HEROLD of Atotech, who will underline the importance of reliability when plating electrolytic stacked blind micro vias (BMVs), and give an overview about the latest findings & developments in electrolytic copper.
The continuously increasing thermo-mechanic reliability requirements for e.g. automotive electronics and 5G hand-held PCBs needs a better understanding of all production processes.
Apart from the contribution of the well-known factors like base material properties, pressing/lamination & drilling conditions, de-smearing & deposition parameter of the conductive seed layer, the set-up of the electrolytic copper process plays an important role in advanced interface reliability between stacked micro-vias.
The webinar introduces into the gives an overview about the latest findings & developments in electrolytic copper.
There will be a Q&A session after the last speaker.
For EIPC members the seminar is free of charge; for non-members the fee will be € 50,-.