EIPC Technical Snapshot Webinar – Nov 24, 2021
Review by Pete Starkey I-Connect007
WEDNESDAY 24th November @ 15.00 hrs CET
Programme:
15.00 hrs
Dyconex, Daniel Schulze
“Advanced high density packaging substrates for RF and miniaturization”
15.15 hrs
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Lars Böttcher
“Development of High-Density Substrate Technologies for Fan-Out and Panel-Level Packaging”
15.30 hrs
Semikron Elektronik GmbH, Michael Schleicher
“Disruptive approach in the design and tool chain of additively manufactured circuit boards”
15.45 hrs Q&A.
For EIPC members the webinar is free of charge; for non-members the fee is € 50,-.
Price
- MEMBERS (regular): FREE OF CHARGE
- NON-MEMBERS (regular): € 50,-