EIPC Technical Snapshot Webinar – Nov 24, 2021

Review by Pete Starkey I-Connect007

WEDNESDAY  24th November @ 15.00 hrs CET

15.00 hrs
Dyconex, Daniel Schulze
“Advanced high density packaging substrates for RF and miniaturization”

15.15 hrs
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, Lars Böttcher
“Development of High-Density Substrate Technologies for Fan-Out and Panel-Level Packaging”

15.30 hrs
Semikron Elektronik GmbH, Michael Schleicher
“Disruptive approach in the design and tool chain of additively manufactured circuit boards”

15.45 hrs Q&A.

For EIPC members the webinar is free of charge; for non-members the fee is € 50,-.

  • Price

    • MEMBERS (regular): FREE OF CHARGE
    • NON-MEMBERS (regular): € 50,-