EIPC Technical Snapshot Webinar – Sep 14, 2022
Summer is over, now it’s back to work. What better way to ease oneself back into the fray is there than to sit in on an EPC Webinar – a vital source of information in this fast-changing world of electronics. To keep up, step up and book your place now.
We will have three speakers, each having a 15-minute slot, with a Q&A session at the end. The Moderator will be Alun Morgan, our President, and the speakers are:
15:05 CET From Fraunhofer ILT, Jonas Mertin, whose paper is “The fully printed smart component – Combining additive manufacturing and sensor printing”
Abstract: The demand for components with integrated functions, in particular sensors is rising. Printed electronics are increasingly relevant to the large-scale industrialization and commercialization 10 of integrated sensors and functionalities. In addition, 3D printing enables the production of virtually any component. To equip high-value components with printed sensors medium lot sizes, direct printing of functionalities onto a semi-finished or finished component is the most automatable approach to manufacturing. This approach can be used to add various functions to 3D-printed components as well.
15:20 CET From IQ evolution GmbH, Dr. Thomas Ebert will present a paper called “Metal 3D printing, just a tool for prototyping or a serious manufacturing process for mass production?”
Abstract: With metal 3D printing, the smallest structures and cavities can be produced within closed housings, which only have the inlets and outlets as openings. This process has been used to create coolers for power electronics that can dissipate very large amounts of heat in a very small space. In the present case, a strongly turbulent flow is generated inside the cooler. In conjunction with very small wall thicknesses in the range of 150 µm, stainless steel, for example, can be used as a cooler material and yet very high heat flux densities can be safely dissipated.
15:35 CET And finally from ioTech Group Ltd., Dr. Ralph Birnbaum will present a paper entitled “Digital Mass Manufacturing of Electronics – Breaking the Mould”
Abstract: With C.L.A.D. (Continuous Laser Assisted Deposition), a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This releases perfectly consistent drops of material onto the substrate below. The material drops can then be sintered or cured inline, in the same machine. A great benefit is that this technology works for solder and polymers as well as for metals and ceramics. Multiple materials can be printed at the same time. This new technology opens the way to new advanced applications and the fabrication of innovative materials and novel applications. C.L.A.D. systems can work with many materials currently on the market and will be leveraged for any application in the electronics supply chain where one material is applied or bound to another. Material viscosities can exceed 300,000 cPs and fillers of more than 40µm can be added.
May we please invite you to join us, this is free for EIPC members, but for non-members it is just € 50.-.