Review KEYNOTE SESSION by Pete Starkey
EIPC Winter Conference Review: A Focus on Miniaturization
EIPC Winter Conference Review: From Innovation to Qualification
The EIPC Winter conference will be held on February 3 & 4, 2026 in Aix-en-Provence near Marseille, France.
“Driving the Future: Innovation, Energy, and Sustainability in PCB Technology”
| Conference Day 1, Tuesday February 3 |
|
| 08:00-08:30 |
Conference Registration and Table Top & Poster Exhibition build up |
Table Top & Sponsor Lounge |
| 08:30-08:45 |
Welcome by the EIPC President |
EIPC, Rico Schlüter, BE |
| Keynote Session 1: Business Outlook and New Opportunities |
Moderator: Tarja Rapala-Virtanen, EIPC, FI |
| 08:45-09:15 |
Business Outlook: Global Electronics Industry |
Custer Consulting, Jon Custer, USA |
| 09:15-09:45 |
European insights into PCB and EMS Market data |
In4ma-Data4PCB, Dieter Weiss, DE |
| 09:45-10:15 |
Training the Next Generation of PCB Designers |
PCEA, Mike Buetow, USA |
| 10:15-10:30 |
Q&A |
|
| 10:30-11:00 |
Coffee break & Table top Networking Sponsor Lounge |
| Session 2: Miniaturization and Fine-Line PCB Production: From Design to Manufacturing |
Moderator: Thomas Michels, Ilfa GmbH, DE |
| 11:00-11:30 |
Miniaturization and Fine-Line PCB Production |
Dyconex, Dr. Roland Steim, CH |
| 11:30-12:00 |
How New Technologies Push Interconnects to the Next Level of Integration |
Multek, Henk Berkel, NL |
| 12:00-12:10 |
Q&A |
|
| 12:10-13:00 |
Networking Lunch Hotel Restaurant |
|
| Session 3: PCB Manufacturing Process Automation and New Flex Circuit Solutions |
Moderator: Emma Hudson, EHTC, UK |
| 13:00-13:30 |
Case Studies in Process Design for Achieving Strategic Autonomy in PCB Fabrication |
Smart Process Design, Alexander Stepinski, PO |
| 13:30-14:00 |
Superlong-FPC: Enabler of new battery technologies for E-Mobility and Energy Storage |
CEE PCB, Markus Voeltz, DE |
| 14:00-14:10 |
Q&A |
|
| 14:15-18:00 |
Departure from Renaissance Aix-en-Provence Hotel: Guided tour ITER |
| 19:00 |
Networking Dinner La Rotonde Aix-en-Provence |
| 22:00 |
Return to Renaissance Aix-en-Provence Hotel |
| Conference Day 2, Wednesday February 4 |
|
| Session 4: From Innovation to Qualification: New Materials, Processes and Applications |
Moderator: Martyn Gaudion, Polar Instruments, UK |
| 09:00-09:30 |
Ideation > Certification > Qualification > Integration |
Jiva Materials, Steve Driver, UK |
| 09:30-10:00 |
PCB Base materials as a strategic performance driver for AI hardware |
Nan Ya Plastics Corp., Andreas Folge, DE |
| 10:00-10:30 |
Impedance field solver accuracy at UHDI dimensions |
Polar Instruments, Martyn Gaudion, UK |
| 10:30-11:00 |
Towards Sustainable PCB Substrates: System-Level Considerations for Bio-Based Laminates |
Virenti, Victor Verlinden, BE |
| 11:00-11:15 |
Q&A |
|
| 11.15-11.45 |
Coffee break & Table top Networking |
| 11.45-13.15 |
Panel Discussion: Supply Chain Improvements, Weaknesses, Sustainability |
Moderator: Rico Schlüter, EIPC, BE |
|
How do PCB Manufacturers incorporate EU regulations? |
|
Panel participants: Adeon, Amphenol-Invotec, Elvia, Group ACB, Ilfa GmbH |
| 13.15-13.20 |
Closing remarks by EIPC President, Rico Schlüter |
| 13.20-14.00 |
Networking Lunch |
