| Conference Day 1, Tuesday February 4 |
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| 08:00-08:30 |
Conference Registration and Table Top & Poster Exhibition build up |
Table Top & Sponsor Lounge |
| 08:30-08:50 |
Welcome by the EIPC President |
EIPC, Alun Morgan, UK |
| 08:50-09:00 |
Welcome by Circuit Foil |
Circuit Foil, Julie Mouzon, LU |
| Keynote Session 1: Business Outlook and New Opportunities |
Moderator: Tarja Rapala-Virtanen, EIPC, FI |
| 09:00-09:30 |
Business Outlook: Global Electronics Industry |
Alun Morgan obo, Custer Consulting, USA |
| 09:30-10:00 |
EMS needs and expectations |
Incap Corporation, Otto Pukk, EE |
| 10:00-10:10 |
Q&A |
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| 10:10-10:40 |
Coffee break & Table top Networking Sponsor Lounge |
| Session 2: Requirements for Manufacturability of Today’s and Future PCBs |
Moderator: Thomas Michels, Ilfa GmbH, DE |
| 10:40-11:00 |
“Stackup & Signal Integrity considerations for UHDI” With benefits for conventional fine line constructions |
Polar Instruments, Martyn Gaudion, UK |
| 11:00-11:20 |
Leading Edge Fineline PCB Production |
Dyconex, Dr. Tamara Aderneuer, CH |
| 11:20-11:40 |
How the new challenges of electronics will impact DfM |
ASTER Technologies, Christophe Lotz, FR |
| 11:40-11:50 |
Q&A |
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| Session 3: Advanced Innovations in PCB Manufacturing |
Moderator: Jean-Claude Roth, CCI Eurolam, FR |
| 11:50-12:10 |
XACT-PCB tools |
Adeon, Andre Bodegom, NL |
| 12:10-12:30 |
Shoda Synchronized Cutting |
SAT, Milena Fritz, DE |
| 12:30-12:40 |
Q&A |
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| 12:40-13:40 |
Networking Lunch Hotel Restaurant |
| 13:40-14:00 |
Coffee break & Table top Networking Sponsor Lounge |
| Session 4: Circular Economy and Sustainability |
Moderator: Emma Hudson, EHTC, UK |
| 14:00-14:20 |
Sustainable Success: Incap’s journey towards growth |
Incap Corporation, Helena Maripuu, EE |
| 14:20-14:40 |
Additive, precise and sustainable; how s.mask is redefining the solder mask |
Wurth Elektronik, Michael Matthes, DE |
| 14:40-15:00 |
Sustainable materials for the electronics industry |
Papershell AB, Marcus von Euler, SE |
| 15:00-15:20 |
Automating EPR reporting: Leveraging AI for Eco-Modulation and sustainability compliance |
ForSure Europe, Daniel Hamandouche, NL |
| 15:20-15:40 |
Advances in Manufacturing Efficiency utilizing Circular Economy Systems |
Smart Process Design, Alexander Stepinski, PL |
| 15:40-15:55 |
Q&A |
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| 16:00 |
Departure from DoubleTree by Hilton hotel: Guided tour Circuit Foil |
| 19:00 |
Networking Dinner Restaurant SixSeven |
| 22:00 |
Return to DoubleTree by Hilton Hotel |
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| Conference Day 2, Wednesday February 5 |
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| Session 5: Key Factors Influencing PCB Material Selection- Requirements and Solutions |
Moderator: Martyn Gaudion, Polar Instruments, UK |
| 09:00-09:20 |
Materials for radar applications: What influences the radar application performance, and is it only the electrical performance which matters? |
Resonac Europe GmbH, Dr. Anna Graf, DE |
| 09:20-09:40 |
The Car of the Future: Opportunities Enabled by High-Speed Digital Materials |
NanYa Plastics, Andreas Folge, DE |
| 09:40-10:00 |
Advancing Safety and Reliability in Automotive Radar with Specialized PCB Materials |
Rogers BV, Stefano Dada, BE |
| 10:00-10:10 |
Q&A |
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| Session 6: PCB Processes- Historical Insights and Innovations in Copper and Surface Finishes |
Moderator: Oldrich Simek, PragoBoard, CZ |
| 10:10-10:30 |
The Evolution of Electro-deposited Copper through Technological Advancements and Innovations in Modern Electronics Manufacturing |
Circuit Foil, Antoine Marot, LU |
| 10:30-10:50 |
ASIG (Autocatalytic Silver Immersion Gold), an alternative finish with improved properties over ENIG for RF designs and wire bonding |
Icape Group, Erik Pedersen, FR |
| 10:50-11:00 |
Q&A |
| 11:00-11:40 |
Coffee break & Table top Networking Sponsor Lounge |
| Quick Fire Walk In |
Moderator: Alun Morgan, EIPC, UK |
| 11:40-12.30 |
Incap Corporation, Wurth Elektronik, Papershell AB, ForSure Europe |
| 12:30-12:35 |
Closing remarks by EIPC President Mr. Alun Morgan |
| 12:35-14:00 |
Networking Lunch Hotel restaurant |
