EIPC Winter Conference – Feb 9-10, 2023

REVIEW PETE STARKEY I-CONNECT007 CONFERENCE DAY 1

REVIEW PETE STARKEY I-CONNECT007 CONFERENCE DAY 2

It brings us great pleasure to announce that our upcoming Winter Conference, which will be held on Thursday and Friday 9th & 10th February 2023 in Lyon, France.

Not only are we going to have an excellent conference programme with the best speakers available on February 9, but we will be making a visit to the Nuclear Power Plant in Bugey on February 10. There will be a Conference Dinner at a magnificent restaurant in Lyon.

Conference Day 1, Thursday February 9
08:00-08:30 Conference Registration and Table Top & Poster Exhibition build up Table Top & Poster Display Area
08:30-08:45 Welcome by the EIPC President Alun Morgan, EIPC, UK
Session 1: Business Outlook and Energy Security
08:45-09:15 Business Outlook: Global Electronics Industry Alun Morgan obo Custer Consulting, USA
09:15-09:35 IC substrate : key element of the Packaging industry Emilie Yolivet, Yole Intelligence part of Yole Group, FR
09:35-10:05 A charcoal sketch of a sustainable energy system Gerrit Jan Schaeffer, EnergyVille, BE
10:05-10:20 Q&A
10:20-10:50 Coffee break & Table top Networking
Session 2: Environment and Sustainability
10:50-11:10 Ericsson Supplier Climate Action Stig Källman, Ericsson, SE
11:10-11:30 Novel Ni-free Surface Finish for 5G mm Wave frequency PCB Technologies How to achive Optimum Signal Integrity Dr. Kunal Shah, LiloTree, USA
11:30-11:50 Texturing of metallic films using a novell process Roland Bejjani, DP Patterning, SE
11:50-12:00 Q&A
Session 3: New process technology and Smart manufacturing
12:00-12:20 Length-agnostic FPC manufacturing Philip Johnston, Trackwise, UK
12:20-12:40 Smart PCB Factory Claudio Bellistri, KLA-Orbotech, BE
12:40-13:00 Smart Factory Solutions Frank Tinnefeld, ASS-Luippold, DE
13:00-13:10 Q&A
13:10-14:10 Networking Lunch
Session 4: Additive manufacturing and New materials
14:10-14:30 Control on solder mask thickness made easy, the inkjet way Bas Le Grand, SUSS MicroTec, NL
14:30-14:50 LCP as biomaterial for neural implants Carina Luchsinger, Dyconex, CH
14:50-15:10 Increased reliability through stress absorption- A new prepreg absorbing thermal induced stress Dr. Anna Graf, RESONAC Europe GmbH, DE
15:10-15:30 High Speed PCB material Technology Trends Yonghyon Kim, Doosan Corporation Electro Materials Europe, DE
15:30-15:40 Q&A
15:40-16:10 Coffee break & Table top Networking
Session 5: Round table for environmental e.g. REACH SVHC solder mask restrictions
16:10-17:00 Electra Polymers – SUSS MicroTec – Notion Systems – Agfa Gevaert-Taiyo America-Parachem Consulting Chemists
17:00-17:30 Coffee break & Table top Networking
17:30
End of Conference
19:00 Departure Kopster Hotel by bus for Networking Dinner
19:30 Networking Dinner Lyon
Conference Day 2 & Visit Bugey Nuclear Power Plant, Friday February 10
08:15 Departure from Kopster Hotel Lyon Groupama Stadium
09:00 Arrival Bugey Nuclear Power Plant
09:10-10:15 Welcome and Presentation EDF
10:15-12:30 GROUP 1 Preparation & Tour Nuclear Power plant
GROUP 2 Session 6: Material solutions for challenging conditions
10:30-10:55 Development and evaluation of Thermally stable antenna materials for automotive radar Anthony Pascalet, AGC, FR
10:55-11:20 Laminates for High Performance computing and the Automotive industry Andreas Folge, NanYa Plastics Corp, DE
11:20-11:45 Managing PCB Stackup across the global supply chain Martyn Gaudion, Polar Instruments, UK
11:45-12:00 Q&A
12:00-12:30 Coffee break Group 2
12:30-13:15 Networking Lunch
13:15-15:30 GROUP 2 Preparation & Tour Nuclear Power plant
GROUP 1 Session 6: Material solutions for challenging conditions
13:30-13:55 Development and evaluation of Thermally stable antenna materials for automotive radar Anthony Pascalet, AGC, FR
13:55-14:20 Laminates for High Performance computing and the Automotive industry Andreas Folge, NanYa Plastics Corp, DE
14:20-14:45 Managing PCB Stackup across the global supply chain Martyn Gaudion, Polar Instruments, UK
14:45-15:00 Q&A
15:00-15:30 Coffee break Group 1
15:30 Departure from Bugey Nuclear Power Plant to Kopster Hotel Lyon Groupama Stadium
16:00 Arrival Kopster Hotel Lyon Groupama Stadium
  • Price

    • MEMBER : € 725 Full Conference
    • NON-MEMBER : € 900 Full Conference

Who is attending the conference in Lyon?

ACB
Adeon
AGC
Agfa Gevaert
ASS-Luippold
Aspocomp
ATIS SA
CCI Eurolam
Circuit Foil
Clariant
Comintel/ITEQ
Custer Consulting
Doosan
DP Patterning
Dyconex
EHTC
Electra Polymers
Elsyca
EnergyVille
Ericsson
HKC
Isola
KLA
Kubatronic
Lackwerke Peters
Laminates Trading Service
LiloTree
MacDermid Enthone
Meredit
NanYa Plastics
Notion Systems
Optimum Anode Technologies
PCB Connect
Polar Instruments
Polytron-Print GmbH
Pragoboard
Printprcoess
Sanmina
Resonac Europe GmbH
Rogers Corporation
RS-PCB Solutions
Schmoll Maschinen
SUSS MicroTec
Taiyo America
TaRiYa
Techci Rhône-Alpes
Technolam
Teltonika
Thales Global Services
Trackwise
TTM
Ucamco
Varioprint
Ventec Europe
Yole Group

Conference location:
Groupama Stadium Lyon

Hotel:
Kopster Hotel Lyon Groupama Stadium
Use hotel reservation code: EIPC