| Conference Day 1, Thursday February 9 |
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| 08:00-08:30 |
Conference Registration and Table Top & Poster Exhibition build up |
Table Top & Poster Display Area |
| 08:30-08:45 |
Welcome by the EIPC President |
Alun Morgan, EIPC, UK |
| Session 1: Business Outlook and Energy Security |
| 08:45-09:15 |
Business Outlook: Global Electronics Industry |
Alun Morgan obo Custer Consulting, USA |
| 09:15-09:35 |
IC substrate : key element of the Packaging industry |
Emilie Yolivet, Yole Intelligence part of Yole Group, FR |
| 09:35-10:05 |
A charcoal sketch of a sustainable energy system |
Gerrit Jan Schaeffer, EnergyVille, BE |
| 10:05-10:20 |
Q&A |
| 10:20-10:50 |
Coffee break & Table top Networking |
| Session 2: Environment and Sustainability |
| 10:50-11:10 |
Ericsson Supplier Climate Action |
Stig Källman, Ericsson, SE |
| 11:10-11:30 |
Novel Ni-free Surface Finish for 5G mm Wave frequency PCB Technologies How to achive Optimum Signal Integrity |
Dr. Kunal Shah, LiloTree, USA |
| 11:30-11:50 |
Texturing of metallic films using a novell process |
Roland Bejjani, DP Patterning, SE |
| 11:50-12:00 |
Q&A |
| Session 3: New process technology and Smart manufacturing |
| 12:00-12:20 |
Length-agnostic FPC manufacturing |
Philip Johnston, Trackwise, UK |
| 12:20-12:40 |
Smart PCB Factory |
Claudio Bellistri, KLA-Orbotech, BE |
| 12:40-13:00 |
Smart Factory Solutions |
Frank Tinnefeld, ASS-Luippold, DE |
| 13:00-13:10 |
Q&A |
| 13:10-14:10 |
Networking Lunch |
| Session 4: Additive manufacturing and New materials |
| 14:10-14:30 |
Control on solder mask thickness made easy, the inkjet way |
Bas Le Grand, SUSS MicroTec, NL |
| 14:30-14:50 |
LCP as biomaterial for neural implants |
Carina Luchsinger, Dyconex, CH |
| 14:50-15:10 |
Increased reliability through stress absorption- A new prepreg absorbing thermal induced stress |
Dr. Anna Graf, RESONAC Europe GmbH, DE |
| 15:10-15:30 |
High Speed PCB material Technology Trends |
Yonghyon Kim, Doosan Corporation Electro Materials Europe, DE |
| 15:30-15:40 |
Q&A |
| 15:40-16:10 |
Coffee break & Table top Networking |
| Session 5: Round table for environmental e.g. REACH SVHC solder mask restrictions |
| 16:10-17:00 |
Electra Polymers – SUSS MicroTec – Notion Systems – Agfa Gevaert-Taiyo America-Parachem Consulting Chemists |
| 17:00-17:30 |
Coffee break & Table top Networking |
| 17:30 |
|
| 19:00 |
Departure Kopster Hotel by bus for Networking Dinner |
| 19:30 |
Networking Dinner Lyon |
| Conference Day 2 & Visit Bugey Nuclear Power Plant, Friday February 10 |
|
| 08:15 |
Departure from Kopster Hotel Lyon Groupama Stadium |
| 09:00 |
Arrival Bugey Nuclear Power Plant |
| 09:10-10:15 |
Welcome and Presentation EDF |
| 10:15-12:30 |
GROUP 1 Preparation & Tour Nuclear Power plant |
|
GROUP 2 Session 6: Material solutions for challenging conditions |
| 10:30-10:55 |
Development and evaluation of Thermally stable antenna materials for automotive radar |
Anthony Pascalet, AGC, FR |
| 10:55-11:20 |
Laminates for High Performance computing and the Automotive industry |
Andreas Folge, NanYa Plastics Corp, DE |
| 11:20-11:45 |
Managing PCB Stackup across the global supply chain |
Martyn Gaudion, Polar Instruments, UK |
| 11:45-12:00 |
Q&A |
|
| 12:00-12:30 |
Coffee break Group 2 |
| 12:30-13:15 |
Networking Lunch |
| 13:15-15:30 |
GROUP 2 Preparation & Tour Nuclear Power plant |
|
GROUP 1 Session 6: Material solutions for challenging conditions |
| 13:30-13:55 |
Development and evaluation of Thermally stable antenna materials for automotive radar |
Anthony Pascalet, AGC, FR |
| 13:55-14:20 |
Laminates for High Performance computing and the Automotive industry |
Andreas Folge, NanYa Plastics Corp, DE |
| 14:20-14:45 |
Managing PCB Stackup across the global supply chain |
Martyn Gaudion, Polar Instruments, UK |
| 14:45-15:00 |
Q&A |
|
| 15:00-15:30 |
Coffee break Group 1 |
|
| 15:30 |
Departure from Bugey Nuclear Power Plant to Kopster Hotel Lyon Groupama Stadium |
| 16:00 |
Arrival Kopster Hotel Lyon Groupama Stadium |
