High Density Packaging User Group Announces the Jack Fisher Technical Excellence Award
High Density Packaging (HDP) User Group announces the Jack Fisher Technical Excellence Award to honor the memory
of Jack, who passed away on January 20, 2023.
Jack served as an HDP Facilitator for more than 18 years and was a major contributor to the growth of HDP over the course of his tenure.
“Jack was a printed circuit board industry icon, which was recognized by his election to the IPC Hall of Fame in 2006. His expertise and experience will be missed by members and staff alike”, said Larry Marcanti, Executive Director of HDP User Group.
The Jack Fisher Technical Excellence Award will be awarded to HDP members who best exemplify the standards set by Jack over the course of his stellar career.
The eulogy given by Larry can be seen here: https://youtu.be/lZGMvZP5FDU
Jack’s obituary: https://www.pressconnects.com/obituaries/bps136484
HDP User Group (www.hdpug.org), a global research and development organization based in Round Rock, Texas celebrating its 30th anniversary this year, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Tokyo. For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Madan Jagernauth at firstname.lastname@example.org, phone number +1561.501.1567.