Elevate your HDI projects with VT-47LT. Where reliability meets innovation
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg.
Are Microvia Failures Plaguing Your HDI Any Layer Designs?
High-density interconnect (HDI) designs are pushing the envelope – higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations. But there’s a critical flaw: microvias fail far more often than plated through-holes in advanced designs, putting reliability on the line.
The root cause? Thermal mismatch. Differences in coefficient of thermal expansion(CTE) between the microvia fill material and surrounding dielectric create stress during thermal excursions, weakening the microvia barrel and cap. It gets worse, copper and epoxy expand and contract at different rates under thermal cycling, with epoxy’s higher CTE driving tensile stress on the copper cap plating. Repeated thermal cycling intensifies this fatigue initiating micro-cracks that spread into the microvia barrel or epoxy core, threatening the integrity of the entire interconnect.
Introducing VT-47LT: Next-Generation Low CTE prepreg for HDI Innovation
Ventec’s VT-47LT, a cutting-edge IPC 4101/126 prepreg that steps up to meet the demands of modern HDI technology, avoiding the need for time consuming and expensive requalification of alternative IPC4101 grades. With best-in-class Z-axis CTE, it delivers unrivalled reliability right where you need it. Its advanced low-CTE epoxy slashes thermal expansion mismatches, easing stress on microvia structures and tackling the persistent challenge of failures head-on.
Engineered with optimized properties, best-in-class Z-axis CTE and superior thermal resilience, VT-47LT cuts stress on microvias, reducing crack risks and boosting durability. It’s a game-changer delivering robust, long lasting HDI PCBs
Elevate your HDI projects with VT-47LT — where reliability meets innovation!
Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com
About Ventec International Group
Ventec International Group Co., Ltd. is a Taiwan Stock Exchange listed (TWSE:6672.TT) global supplier of advanced base materials for the PCB industry worldwide. Ventec’s range of laminates & prepregs include signal integrity/high-speed digital, RF/Analog & high-performance IMS material technology, and an advanced range of thermal management solutions designed for specialized use in industries including automotive, communication, aerospace, and defense. Ventec also provides value-added one-stop shop services to support PCB manufacturing and distributes a range of third-party materials and automated production equipment that complement its core product offering. Operating its own fully controlled and managed global supply chain and worldwide sales and technical support network, Ventec has manufacturing, and distribution facilities located throughout Asia, Europe, and the US, certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015.
For more information, visit www.venteclaminates.com
