Entries by EIPC

Ventec Meets Demand for Taiyo LPI Solder Mask Products in Europe

Following Ventec’s announcement of its exclusive distribution agreement with Taiyo, customers in mainland Europe & the UK are now guaranteed reliable, immediate and flexible access to the full color range of Taiyo Liquid Photoimageable (LPI) Solder Mask inks. Quickest order to delivery turnaround times are guaranteed through Ventec’s fully managed and controlled supply chain from […]

High Density Packaging User Group Announces Grace Electron Membership

High Density Packaging (HDP) User Group is pleased to announce that Grace Electron Technology Co., LTD. (Grace Electron) has become a member. “Grace Electron is a leading manufacturer of advanced halogen-free laminates suitable for high-frequency, high-speed applications,” said Dr. Winston Wong, CEO at Grace T.H.W. Group. “These laminates are used for telecommunications products that require […]

PCB Technologies launches iNPACKTM , a Miniaturization, and Advanced Packaging solution Provider

iNPACK focuses on advanced microelectronics packaging technology for improved signal integrity and increased functionality PCB Technologies introduces iNPACK, an advanced heterogeneous integration provider of System-in-Package (SiP) solutions. iNPACK, launching in July, is a subsidiary of PCB Technologies, an industry leader in PCB fabrication, assembly, and box builds. iNPACK focuses on high-end technology that contributes to […]

Polar June news: Summary of what’s new in Si9000e for 2022

Two Polar news items for you this month: 1. Many customers requested an update of the latest features in Si9000e so here are the latest updates all rolled into one presentation – newest items first… https://www.polarinstruments.com/2022/Si9000e_May_2022.pdf 2. If insertion loss is of interest – this recent Polar article in iconnect007 may also be of use: […]