Polar May news: ACCM join Speedstack material partner program / Book launch at EIPC Edinburgh June 3rd /4th
Two May news items from Polar:
1. Advanced Chip & Circuit materials join Speedstack material partners:
Bringing novel Next Generation Ultralow loss materials for UHDI into the Speedstack library system*.
https://adv-ccm.com/
2. European book launch for “More Secrets of High Speed PCBs”
I will be launching the follow on to “Secrets of High Speed PCBs” at the upcoming EIPC Summer conference in Edinburgh.
Complimentary copies provided for all participating delegates. More EIPC information email Kirsten Smit-Westenberg
EIPC:Program here
Register here
For updates – or a Polar Speedstack evaluation license, please contact polarcare.
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